Unisem Will Spend RM396 Million on a Second Phase at Its Gopeng Chip Plant

Unisem (M) Berhad filed plans with Bursa Malaysia on 9 October for a second phase at its Gopeng, Perak plant. The project totals about RM396 million once a subsidiary's fit-out costs are added in.

How is Unisem funding the Gopeng expansion?

• The building, infrastructure and utilities alone are estimated at RM196 million (Bursa filing GA1-09102026-00040, 9 Oct 2026).
• Once built, Unisem will lease half the facility to its wholly-owned subsidiary Unisem Advanced Technologies (UAT), which will expand wafer bumping there (same filing).
• The company points to rising demand for advanced packaging — wafer bumping and post-bump services for AI, data-centre and HPC chips (The Star, 9 Oct 2026).

Bursa also placed Unisem and its structured warrants under a short direct-business- transaction bar on 9 October “due to a material announcement” — the standard mechanical step the exchange takes around a filing like this one, not a separate event. This site tracks Unisem's live price and discussion on its own stock page, alongside the rest of the Bursa heat list.

What to watch

• 9 Oct 2026Phase 2 Gopeng filing lodged with Bursa Malaysia (ref GA1-09102026-00040).
• Not yet disclosedBoard approval timeline, the funding source for the RM196 million build cost, and a target completion date have not been stated in the filing or coverage so far.

Sources & further reading

• KLSE Screener — Unisem, Phase 2 Expansion of the Gopeng Plant (Bursa ref GA1-09102026-00040)
• The Star — Unisem proposes Phase 2 expansion of Gopeng facility (9 Oct 2026)
• BusinessToday — Unisem to invest RM396 million in Phase 2 Gopeng semiconductor plant expansion (9 Oct 2026)
• KLSE Screener — Unisem, Forbid of Direct Business Transaction due to Rule 10.10(3) (Bursa ref ISA-09102026-00002)
• Yahoo Finance — Unisem (5005.KL) price data